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Role description

Ethernet Scale-Up RTL Lead/Principal Engineer

TYLsemi logoTYLsemi, Inc.
Zero to one
TypeFull-time
WorkplaceOn-site
SeniorityPrincipal
Salary$237,500–$286,000
LocationSan Jose, CA
Posted8/14/2026
Engineering

Role Overview

TYLsemi is developing purpose-built connectivity chiplet for HPC/rack-scale AI systems. We are seeking a Principal Engineer Ethernet Scale-up to lead the architecture and design of next-generation Ethernet Scale-Up Networking (ESUN) solution. This is a high-impact technical role. 

What You'll Do

  • Define architecture for Ethernet-based AI scale-up interconnects and accelerator fabrics.
  • Lead development of high-performance Ethernet Subsystem microarchitectures including RDMA, packet processing, network offload, traffic management, congestion control, and reliability mechanisms.
  • Drive execution from architecture through RTL, verification, physical design, silicon bring-up, and production.
  • Optimize performance, latency, scalability, power, and reliability for demanding AI and HPC workloads.
  • Collaborate across hardware, firmware, software, and system teams to deliver industry-leading AI networking solutions.
  • Serve as a company-wide technical leader, influencing product strategy, roadmap, and architectural direction.

What We're Looking For

  • 15+ years of ASIC/SoC architecture and design experience.
  • Proven track record delivering networking, NIC, switch, DPU, accelerator interconnect, or high-speed connectivity silicon.
  • Deep expertise in SystemVerilog/RTL design and high-performance datapath architecture. 
  • Strong knowledge of Ethernet, RDMA, traffic management, congestion control, and scalable fabric architectures.
  • Experience across the full ASIC lifecycle, from architecture to production silicon.

Good to Have

  • Ultra Ethernet, UALink, RoCEv2, InfiniBand
  • PCIe Gen6/Gen7, UCIe, CXL
  • AI/HPC interconnects and collective communication acceleration
  • 400G/800G/1.6T Ethernet systems
  • High-speed SerDes and advanced networking architectures

Success in This Role Looks Like

  • Ethernet Scale-Up Networking architecture is defined and validated for next-gen HPC/rack-scale AI systems, with clear technical direction across accelerator fabrics.
  • High-performance Ethernet subsystem microarchitecture (RDMA, packet processing, offload, traffic management, congestion control) is delivered on schedule and meets production-quality reliability bars.
  • Programs move cleanly from architecture through RTL, verification, physical design, and silicon bring-up with minimal rework.
  • Performance, latency, power, and reliability targets are met or exceeded for demanding AI/HPC workloads.
  • Cross-functional teams (hardware, firmware, software, systems) are aligned and unblocked, with this role recognized as a trusted technical authority shaping product strategy and roadmap.

Compensation:
The compensation range shown below represents total target cash compensation and includes both base salary and target bonus. Actual compensation will vary based on factors such as experience, skills, qualifications, job level, and work location.

In addition to cash compensation, this position is eligible for equity in the form of stock options, giving you the opportunity to share in the Company’s long-term growth and success.

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Company info

TYLsemi logo

TYLsemi

Built with chiplets, made for AI infrastructure

AI silicon doesn't fail on compute. It fails on the infrastructure around it — power delivery, connectivity, and memory that weren't designed for the scale, speed, and packaging requirements of modern AI systems. TYLsemi builds the chiplet infrastructure layer that solves this. Purpose-built for XPUs and Networking. Standards-based. Designed to integrate directly into your silicon program — not adapted from something else. We're hiring across the US and India. Come build what's missing. https://www.tylsemi.ai/company/careers/

Private companySeedBrand new
Founded2026
HQSan Jose, United States
Unlock human wisdom
ThesisTermsPrivacy
Size
11–50 employees
IndustrySemiconductor Manufacturing
Funding
  • Seed · Jul 14, 2026

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