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Role description

Senior Embedded SERDES Firmware/Diagnostics Engineer

TYLsemi logoTYLsemi, Inc.
AI-native
TypeFull-time
WorkplaceOn-site
SenioritySenior
Salary$180,000–$216,000
LocationSan Jose, CA
Posted10/6/2026
Engineering

Role Overview

We're hiring a senior firmware engineer to architect, develop, and bring up embedded firmware for Ethernet SerDes, retimers, and diagnostics. The role covers SerDes, calibration, manufacturing, and test firmware. You'll work closely with ASIC, module, manufacturing, test, and reliability teams. You'll define ARM and RISC-V control architectures, write digital requirements for custom control ASICs, build a solid firmware development and CI flow, and mentor engineers across programs.

What you'll do

  • Architecture & Development: Architect, develop, debug, and release production firmware for next-generation optical engines and module platforms (SFP/QSFP/OSFP)
  • ASIC & System Specification: Define digital requirements for custom control ASICs, including MCU selection, memory maps, boot sequence, peripherals, telemetry, diagnostics, MACsec engines, and PTP hardware timestamping
  • System Integration: Partner with ASIC, RTL, and verification teams on architecture, board bring-up, and system-level debug
  • Protocols & Interfaces: Build and maintain firmware for Ethernet, PCIe, and SerDes (link training, interop, compliance), PTP/IEEE 1588, MACsec, and host interfaces
  • Bring-Up & Diagnostics: Lead first firmware bring-up on new modules and ASICs, and drive root-cause analysis across lab, qualification, and field returns
  • Manufacturing & Calibration: Deliver firmware for manufacturing test, screening, calibration engines, and lookup tables that support high-yield production
  • DevOps & CI/CD: Own the firmware workflow, including build/release pipelines, automated tests, regression coverage, and CI

What We're Looking For

  • BS/MS/PhD in EE, CE, CS, or equivalent, with 8+ years in embedded firmware
  • Expert C and C-based SDK development; exposure to modern C++ or Rust
  • Experience defining MCU requirements (ARM, RISC-V) and working with I2C, I3C, SPI, MDIO, and GPIO
  • Strong Python for test automation, data processing, and firmware QC
  • Hands-on with GCC/Make, Git/GitHub, Doxygen, CI/CD, and hardware-in-the-loop automation
  • Experience using AI-assisted coding, refactoring, and test generation in an embedded workflow
  • A track record of leading cross-functional bring-up and mentoring engineers

Good to Have

  • MACsec (802.1AE) key management or data-plane acceleration, and PTP hardware timestamping or clock recovery, in optical hardware
  • Root of Trust, Secure Boot, and secure firmware update (FOTA/UFOTA)
  • SerDes management, link-training tuning, and real-time diagnostic frameworks
  • Product qualification, stress testing, reliability investigations, and board-level FA

Compensation

The compensation range shown below represents total target cash compensation and includes both base salary and target bonus. Actual compensation will vary based on factors such as experience, skills, qualifications, job level, and work location.

In addition to cash compensation, this position is eligible for equity in the form of stock options, giving you the opportunity to share in the Company’s long-term growth and success.

Relevant archetypes

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Company info

TYLsemi logo

TYLsemi

Built with chiplets, made for AI infrastructure

AI silicon doesn't fail on compute. It fails on the infrastructure around it — power delivery, connectivity, and memory that weren't designed for the scale, speed, and packaging requirements of modern AI systems. TYLsemi builds the chiplet infrastructure layer that solves this. Purpose-built for XPUs and Networking. Standards-based. Designed to integrate directly into your silicon program — not adapted from something else. We're hiring across the US and India. Come build what's missing. https://www.tylsemi.ai/company/careers/

Private companySeedBrand new
Founded2026
HQSan Jose, United States
Unlock human wisdom
ThesisTermsPrivacy
Size
11–50 employees
IndustrySemiconductor Manufacturing
Funding
  • Seed · Jul 14, 2026

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