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Role description

Lead SoC Performance & Power Engineer

TYLsemi logoTYLsemi, Inc.
TypeFull-time
WorkplaceOn-site
SenioritySenior
Salary$204,000–$250,000
LocationSan Jose, CA
Posted8/13/2026
Engineering

About the role

As our Lead Performance architect, you'll drive the architectural configuration, system-level simulation, and PPA optimization of the chiplet by using industry-standard ESL tools and / or developing  in-house tools to integrate and calibrate highspeed I/O IPs such as PCIe, UCIe and Ethernet as well as NoC fabric into a system. You'll own the trade-off analysis that define what we tape out.

Responsibilities

  • Own PPA exploration and trade-offs between peak performance, silicon area, and thermal/power budgets, and turn that into clear tape-out recommendations.
  • Build transaction-level models (TLM) using commercial ESL suites (e.g. Platform Architect) that integrate third-party IPs such as PCIe, UCIe, and NoC etc into a full-chiplet model.
  • Define, sweep, and validate hardware configuration parameters — buffer sizes, queue depths, clock-domain crossings, routing tables — to maximize throughput and minimize latency across realistic workloads.
  • Characterize traffic across the internal NoC and the UCIe die-to-die interface to find congestion points and rule out protocol deadlocks before they reach silicon.
  • Work directly with our IP vendors to debug model/behavioral mismatches, report performance anomalies, and integrate new IP deliverables as they land.

Required

  • BS/MS in Electrical Engineering or related field with 6+ years in computer architecture, performance modeling, or microarchitecture configuration.
  • Direct, hands-on experience with commercial ESL tools such as Platform Architect, Virtualizer, or comparable frameworks.
  • Solid working knowledge of at least one of: PCIe (Gen 5/6/7), UCIe, or AMBA NoC protocols (AXI/CHI) — and a willingness to get deep on the others.
  • Strong Python for automating large-scale simulation sweeps, parsing performance reports, and analyzing results.
  • Familiarity with SystemC and transaction-level modeling paradigms — enough to write custom traffic generators when the off-the-shelf models fall short.

Nice to have

  • Fluency with power modeling or floor-planning trade-offs.
  • Prior work on a multi-die / chiplet program, or hands-on UCIe die-to-die.
  • Experience taking architectural models through to a real tape-out.

Compensation

The compensation range shown below represents total target cash compensation and includes both base salary and target bonus. Actual compensation will vary based on factors such as experience, skills, qualifications, job level, and work location.

In addition to cash compensation, this position is eligible for equity in the form of stock options, giving you the opportunity to share in the Company’s long-term growth and success.

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Company info

TYLsemi logo

TYLsemi

Built with chiplets, made for AI infrastructure

AI silicon doesn't fail on compute. It fails on the infrastructure around it — power delivery, connectivity, and memory that weren't designed for the scale, speed, and packaging requirements of modern AI systems. TYLsemi builds the chiplet infrastructure layer that solves this. Purpose-built for XPUs and Networking. Standards-based. Designed to integrate directly into your silicon program — not adapted from something else. We're hiring across the US and India. Come build what's missing. https://www.tylsemi.ai/company/careers/

Private companySeedBrand new
Founded2026
HQSan Jose, United States
Unlock human wisdom
ThesisTermsPrivacy
Size
11–50 employees
IndustrySemiconductor Manufacturing
Funding
  • Seed · Jul 14, 2026

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