Staff Field Application Engineer

About the role

We are seeking a Senior Field Applications Engineer to drive customer adoption of Ferric’s IVR products with leading AI semiconductor companies, hyperscalers, ODMs, and advanced compute platform teams. You will bridge Ferric engineering and strategic customers, guiding IVR evaluations, system-level integration, and design-in cycles from early engagement through production readiness.

What you'll do

• IVR Technical Evangelism: Demonstrate Ferric’s integrated voltage regulator products, develop customer-facing collateral, and deliver expert-level IVR training to sales teams, engineers, AI chip customers, hyperscalers, system integrators, contract manufacturers, OSATs and ODMs.
• Customer Enablement: Support specification development, evaluation boards, lab bring-up, and integration reviews for AI semiconductor customers, hyperscalers, ODMs, and contract manufacturers adopting Ferric IVRs. Work closely with Ferric Application Team and customers on power integrity analysis, transient response, packaging, and thermal challenges to develop complete power solutions for customers.
• Bridge to R&D: Consolidate customer requirements from AI and hyperscale platforms into actionable feedback for Ferric’s IVR roadmap, packaging, power architecture, and application support strategy.
• Business Leadership: Communicate IVR value propositions, power-density benefits, thermal advantages, and ROI metrics to technical leaders and customer executives.

Qualifications

• Education: BSEE or MSEE.
• Experience: 5-10 years in Applications Engineering within the power electronics or semiconductor industry.
• Technical Expertise: Deep understanding of integrated voltage regulators, DC-DC power converters/regulators (Buck, Boost, Buck-Boost, LDOs), power integrity, and mixed-signal IC testing.
• Lab Skills: Proficiency with oscilloscopes, DMMs, SMUs, DC power supplies, electronic loads, and spectrum analyzers.
• Soft Skills: Passionate self-starter with excellent written/verbal communication and project management skills.

Preferred/Plus Skills and Experience

• Hands-on experience supporting AI accelerators, hyperscale data center power architectures, advanced packaging, or high-current processor power delivery.
• Familiarity with IC package substrate design, parasitic extraction, and power integrity analysis.
• Knowledge of thermal management for power applications

Software proficiency in Cadence Virtuoso Suite, Cadence Allegro, HSPICE, LaTeX, and Linux

Why Join Ferric?

• Competitive base salary ($140K - $180K) paired with meaningful equity.
• The opportunity to help bring Ferric IVRs into next-generation AI chips and hyperscale compute platforms.
• A collaborative, fast-paced team environment based in the heart of Silicon Valley.