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Role description

SoC IP and System Applications

TYLsemi logoTYLsemi, Inc.
TypeFull-time
WorkplaceOn-site
SenioritySenior
LocationSan Jose, CA
Posted9/26/2026
Operations

About the role

TylSemi is looking for a IP and Systems Application Engineer who can sit at the intersection of silicon, IP, and customer success. You will own the operational thread that connects our stretagic initiatives to customers — making sure every engagement moves with precision from idea to silicon.

This is a high-visibility, high-ownership role at a company in its earliest and most consequential stage. You will work directly with founders, customers, the leading semiconductor ecosystem players. No layers, no ambiguity about impact.

What you'll do

  • Manage active customer engagements: from IP and SoC architectural spec alignment through silicon and systems bringup and volume shipment milestones
  • Ensure alignment with internal enginering and ecosystem partners — including foundries, OSAT/packaging houses, EDA vendors (Synopsys, Cadence), and IP partners
  • Translate customer requirements (silicon architecture, interface specs, package form factor, delivery schedules) into internal program plans with clear owners and dates
  • Build and maintain trackers, risk registers, and executive dashboards covering each engagement
  • Drive gate reviews and weekly program syncs across internal RTL/DV, physical design, and validation teams
  • Manage internal and external scoping and delivery timelines in coordination with technical and business teams
  • Identify and escalate risks early; propose and implement mitigations before they become schedule threats

What you bring

  • 15+ years of technical customer management experience in semiconductor, custom silicon, or chiplet/advanced packaging environments
  • Experience interfacing with ecosystem partners — chip development schedules, interdepencies on EDA and IP, tape-out schedules and system bringup timelines
  • Familiarity with silicon fabrication, advanced packaging formats: CoWoS, InFO, 2.5D/3D integration, substrate/interposer-based assembly
  • Technical fluency in SoC or chiplet design flows — enough to understand RTL milestones, DV sign-off, PD handoffs, and silicon bring-up phases without needing translation
  • Strong communication skills — comfortable presenting program status and risk posture to internal and external stakeholders
  • Proficiency with program tracking tools (and spreadsheet-based trackers); experience building program infrastructure from scratch is a plus
  • Familiarity with key connectivity IPs UCIe, PCIe Gen 5/6/7+, or high-bandwidth D2D interconnect standards is a strong plus

Nice to Have to Shine

  • Prior experience at an IP company, chiplet startup, merchant silicon company, or systems company
  • Background in AI/ML infrastructure silicon — accelerators, network switches, CPO-enabled platforms
  • Exposure to EDA infrastructure programs (SNPS/CDNS cloud flows)

Relevant archetypes

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Company info

TYLsemi logo

TYLsemi

Built with chiplets, made for AI infrastructure

AI silicon doesn't fail on compute. It fails on the infrastructure around it — power delivery, connectivity, and memory that weren't designed for the scale, speed, and packaging requirements of modern AI systems. TYLsemi builds the chiplet infrastructure layer that solves this. Purpose-built for XPUs and Networking. Standards-based. Designed to integrate directly into your silicon program — not adapted from something else. We're hiring across the US and India. Come build what's missing. https://www.tylsemi.ai/company/careers/

Private companySeedBrand new
Founded2026
HQSan Jose, United States
Unlock human wisdom
ThesisTermsPrivacy
Size
11–50 employees
IndustrySemiconductor Manufacturing
Funding
  • Seed · Jul 14, 2026

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