• Provide MEMS/RF package solutions (designing/manufacturing) and associated heat management solution (advanced material);
• Design and manufacture high conductive heat spreaders for Si, GaAs, etc. based RF die and packages with new advanced material;
• Recommend various heat management solution for variety of microelectronics, automotive and military/space devices;
• Workshops and presentation regarding heat management to private/public industries and professional associations;
• Consult, develop and improve solar module fabrication and back-end manufacturing processes including solder screening, PnP, wire bonding, automation and material selection
• Location based service/cloud/apps for networked devices business development
• Program management from prototype to high volume production in consumer electronic products, including display, communication and audio microdevices/modules
o Introduced noise canceling audio products from prototype to high volume manufacturing by defining and planning scopes and executing and monitoring progress
o Very familiar with statistical manufacturing practices and FMEA, failure analysis
o Defined and designed device integrating components and test specifications
o Integral part of R&D in Korea, developing metalized glass and glass-fused metal alloy packages – applied and was granted Korean government grant for small business in Korea developing new hermetic packages
o Responsible for planning, defining and implementing new products and manufacturing processes – resulted in quick turnaround from R&D prototype to high volume production, realized significant revenue within 2 years of new metalized glass hermetic packages for display and communication customers
• Process engineering experience – worked in semiconductor and test equipment and process manufacturers with following emphasis
o Semiconductor processes including deposition, plasma etch, wet etch, gas/resin abatement and encapsulation process (hermetic/non-hermetic microdevices and PV modules)
o Designed, implemented and improved various process/manufacturing practices from prototype stage to high volume production for device packaging, PV modules, and display/communication microdevices
• Manufacturing experience – worked in several start-up companies and high volume 24/7 manufacturing facilities
o Define and setup new manufacturing processes and manage manufacturability and yield improvements in US and Asia, including Korea, China and Taiwan
o Manufacturing process transfer
o Multidisciplinary and national management of contract manufactures, OEMs and vendors